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Core Processor | ARM® Cortex®-M3 |
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Min Operating Temperature | 0°C |
Supplier Device Package | 896-FBGA (31x31) |
Package / Case | 896-BGA |
Core Architecture | ARM |
Lead Free | Lead Free |
RoHS Status | RoHS Compliant |
Primary Attributes | FPGA - 50K Logic Modules |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Speed | 166MHz |
Operating Temperature | 0°C~85°C TJ |
Architecture | MCU, FPGA |
Flash Size | 256KB |
RAM Size | 64KB |
Number of I/O | 377 |
Peripherals | DDR, PCIe, SERDES |
Max Operating Temperature | 85°C |
Series | SmartFusion®2 |
Packaging | Tray |
Part Status | Obsolete |
Frequency | 166MHz |
Published | 2016 |
Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
Base Part Number | M2S050 |
Microchip
FPGA SmartFusion2 Family 4956 Cells 65nm (CMOS) Technology 1.2V 484-Pin FBGA
Microchip
FPGA SmartFusion2 Family 4956 Cells 65nm (CMOS) Technology 1.2V 484-Pin FBGA
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