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BU14OZ-178-HT
the part number is BU14OZ-178-HT
Part
BU14OZ-178-HT
Description
CONN IC DIP SOCKET 14POS GOLD
Lead Free/ROHS
pb RoHs
Datasheets
CAD Models
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Specification
Contact Finish - Mating Gold
Operating Temperature -55°C ~ 125°C
Contact Material - Post Brass
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Contact Finish Thickness - Mating 78.7µin (2.00µm)
Termination Solder
Mounting Type Surface Mount
Product Status Obsolete
Number of Positions or Pins (Grid) 14 (2 x 7)
Pitch - Post 0.100" (2.54mm)
Contact Finish Thickness - Post Flash
Series BU-178HT
Type DIP, 0.3" (7.62mm) Row Spacing
Contact Finish - Post Copper
Pitch - Mating 0.100" (2.54mm)
Contact Material - Mating Beryllium Copper
Features Open Frame
Package Tube
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