100-024-000

100-024-000

Part No100-024-000
Manufacturer3M
DescriptionCONN IC DIP SOCKET 24POS GOLD
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ECAD Module 100-024-000
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Specification
Series100
PackageBulk
Product StatusObsolete
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)24 (2 x 12)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating8.00µin (0.203µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - PostFlash
Contact Material - PostBrass
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Operating Temperature-65°C ~ 125°C
In Stock: 7876
available for immediate sale in a store
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Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product