1814643-8

1814643-8

Part No1814643-8
DescriptionCONN IC DIP SOCKET 10POS GOLD
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ECAD Module 1814643-8
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Specification
Series-
PackageTube
Product StatusObsolete
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)10 (2 x 5)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - Post-
Contact Finish Thickness - Post-
Contact Material - PostBrass
Housing MaterialThermoplastic, Polyester
Operating Temperature-55°C ~ 125°C
In Stock: 21830
available for immediate sale in a store
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Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product