2-1571586-9

2-1571586-9

Part No2-1571586-9
DescriptionCONN IC DIP SOCKET 28POS GOLD
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ECAD Module 2-1571586-9
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Specification
Series800
PackageTube
Product StatusObsolete
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)28 (2 x 14)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating25.0µin (0.63µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post25.0µin (0.63µm)
Contact Material - PostCopper
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature-55°C ~ 105°C
In Stock: 4940
available for immediate sale in a store
Pricing
QTY UNIT PRICE EXT PRICE
1 4.57
10 4.4786
100 4.3415
1000 4.2044
10000 4.0216
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product