522-AG10D

522-AG10D

Part No522-AG10D
DescriptionCONN IC DIP SOCKET 22POS GOLD
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ECAD Module 522-AG10D
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Specification
Series500
PackageTube
Product StatusObsolete
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)22 (2 x 11)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating-
Contact Material - MatingCopper Alloy
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post-
Contact Material - PostCopper Alloy
Housing Material-
Operating Temperature-55°C ~ 125°C
In Stock: 22296
available for immediate sale in a store
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Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product