840-AG11D-ES

840-AG11D-ES

Part No840-AG11D-ES
DescriptionCONN IC DIP SOCKET 40POS GOLD
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ECAD Module 840-AG11D-ES
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Specification
Series800
PackageTube
Product StatusObsolete
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)40 (2 x 20)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating5.00µin (0.127µm)
Contact Material - MatingCopper Alloy
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post-
Contact Material - PostCopper Alloy
Housing MaterialPolyester
Operating Temperature-55°C ~ 105°C
In Stock: 16222
available for immediate sale in a store
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Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product