SIP050-1X22-160BLF

SIP050-1X22-160BLF

Part NoSIP050-1X22-160BLF
ManufacturerAmphenol ICC (FCI)
DescriptionCONN SOCKET SIP 22POS GOLD
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ECAD Module SIP050-1X22-160BLF
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Specification
SeriesSIP050-1x
PackageBulk
Product StatusObsolete
TypeSIP
Number of Positions or Pins (Grid)22 (1 x 22)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBrass
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature-
In Stock: 10671
available for immediate sale in a store
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Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product