SIP1X08-011BLF

SIP1X08-011BLF

Part NoSIP1X08-011BLF
ManufacturerAmphenol ICC (FCI)
DescriptionCONN SOCKET SIP 8POS GOLD
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ECAD Module SIP1X08-011BLF
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Specification
SeriesSIP1x
PackageBulk
Product StatusObsolete
TypeSIP
Number of Positions or Pins (Grid)8 (1 x 8)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBrass
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Operating Temperature-
In Stock: 8328
available for immediate sale in a store
Pricing
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Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product