06-2503-20
Part No06-2503-20
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 6POS GOLD
Datasheet
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ECAD Module
Specification
Series503
PackageBulk
Product StatusActive
TypeDIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)6 (2 x 3)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationWire Wrap
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostPhosphor Bronze
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 105°C
In Stock:
22580
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 167 | 4.242 |
Associated Product
