08-0513-11H

08-0513-11H

Part No08-0513-11H
ManufacturerAries Electronics
DescriptionCONN SOCKET SIP 8POS GOLD
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ECAD Module 08-0513-11H
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Specification
Series0513
PackageBulk
Product StatusActive
TypeSIP
Number of Positions or Pins (Grid)8 (1 x 8)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
Features-
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-
In Stock: 11961
available for immediate sale in a store
Pricing
QTY UNIT PRICE EXT PRICE
241 2.5735
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product