08-6501-20
Part No08-6501-20
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 8POS TIN
Datasheet
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ECAD Module
Specification
Series501
PackageBulk
Product StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)8 (2 x 4)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingTin
Contact Finish Thickness - Mating200.0µin (5.08µm)
Contact Material - MatingPhosphor Bronze
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationWire Wrap
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostPhosphor Bronze
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 105°C
In Stock:
14096
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 120 | 6.0236 |
Associated Product
