10-2513-11H
Part No10-2513-11H
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 10POS GOLD
Datasheet
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ECAD Module
Specification
SeriesLo-PRO®file, 513
PackageBulk
Product StatusActive
TypeDIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)10 (2 x 5)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 105°C
In Stock:
12787
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 143 | 5.656 |
Associated Product
