10-6503-20
Part No10-6503-20
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 10POS GOLD
Datasheet
Download Now!
ECAD Module
Specification
Series503
PackageBulk
Product StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)10 (2 x 5)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationWire Wrap
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostPhosphor Bronze
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 105°C
In Stock:
17890
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 92 | 10.4393 |
Associated Product
