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10-8350-210C
Part No10-8350-210C
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 10POS GOLD
Datasheet
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Specification
Series8
PackageBulk
Product StatusActive
TypeDIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)10 (2 x 5)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame, Elevated
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 105°C
In Stock:
17330
available for immediate sale in a store
available for immediate sale in a store
Pricing
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