12-6621-30

12-6621-30

Part No12-6621-30
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 12POS TIN
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ECAD Module 12-6621-30
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Specification
Series6621
PackageBulk
Product StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)12 (2 x 6)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingTin
Contact Finish Thickness - Mating200.0µin (5.08µm)
Contact Material - MatingPhosphor Bronze
Mounting TypeThrough Hole, Bottom Entry; Through Board
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostPhosphor Bronze
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 105°C
In Stock: 13744
available for immediate sale in a store
Pricing
QTY UNIT PRICE EXT PRICE
40 18.3544
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product