14-3518-11H
Part No14-3518-11H
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 14POS GOLD
Datasheet
Download Now!
ECAD Module
Specification
Series518
PackageBulk
Product StatusActive
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)14 (2 x 7)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-
In Stock:
3165
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 140 | 6.8841 |
Associated Product
