18-3503-31
Part No18-3503-31
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 18POS GOLD
Datasheet
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ECAD Module
Specification
Series503
PackageBulk
Product StatusActive
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)18 (2 x 9)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationWire Wrap
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostPhosphor Bronze
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 125°C
In Stock:
9682
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 32 | 22.1055 |
Associated Product
