20-4518-10H
Part No20-4518-10H
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 20POS GOLD
Datasheet
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ECAD Module
Specification
Series518
PackageBulk
Product StatusActive
TypeDIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid)20 (2 x 10)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-
In Stock:
11352
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 143 | 6.3993 |
Associated Product
