24-6554-16
Part No24-6554-16
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET ZIF 24POS
Datasheet
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ECAD Module
Specification
Series55
PackageBulk
Product StatusActive
TypeDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)24 (2 x 12)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingNickel Boron
Contact Finish Thickness - Mating50.0µin (1.27µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostNickel Boron
Contact Finish Thickness - Post50.0µin (1.27µm)
Contact Material - PostBeryllium Copper
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Operating Temperature-
In Stock:
7384
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 1 | 63.297 |
Associated Product
