28-1518-11H
Part No28-1518-11H
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 28POS GOLD
Datasheet
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ECAD Module
Specification
Series518
PackageBulk
Product StatusActive
TypeDIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)28 (2 x 14)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-
In Stock:
4078
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 71 | 8.8812 |
Associated Product
