28-6556-30
Part No28-6556-30
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 28POS GOLD
Datasheet
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ECAD Module
Specification
Series6556
PackageBulk
Product StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)28 (2 x 14)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationWire Wrap
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBrass
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Operating Temperature-
In Stock:
5000
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 32 | 24.7432 |
Associated Product
