30-1508-31

30-1508-31

Part No30-1508-31
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 30POS GOLD
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ECAD Module 30-1508-31
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Specification
Series508
PackageBulk
Product StatusActive
TypeDIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)30 (2 x 15)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationWire Wrap
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6
Operating Temperature-55°C ~ 125°C
In Stock: 23996
available for immediate sale in a store
Pricing
QTY UNIT PRICE EXT PRICE
22 28.9855
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product