30-6501-30
Part No30-6501-30
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 30POS TIN
Datasheet
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ECAD Module
Specification
Series501
PackageBulk
Product StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)30 (2 x 15)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingTin
Contact Finish Thickness - Mating200.0µin (5.08µm)
Contact Material - MatingPhosphor Bronze
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationWire Wrap
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostPhosphor Bronze
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 125°C
In Stock:
19548
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 55 | 17.4629 |
Associated Product
