32-6823-90C
Part No32-6823-90C
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 32POS GOLD
Datasheet
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ECAD Module
Specification
SeriesVertisockets™ 800
PackageBulk
Product StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)32 (2 x 16)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole, Right Angle, Horizontal
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-55°C ~ 105°C
In Stock:
22460
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 31 | 21.1684 |
Associated Product
