38-6823-90

38-6823-90

Part No38-6823-90
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 38POS GOLD
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ECAD Module 38-6823-90
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Specification
SeriesVertisockets™ 800
PackageBulk
Product StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)38 (2 x 19)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingPhosphor Bronze
Mounting TypeThrough Hole, Right Angle, Horizontal
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostPhosphor Bronze
Housing MaterialPolyamide (PA46), Nylon 4/6
Operating Temperature-
In Stock: 22611
available for immediate sale in a store
Pricing
QTY UNIT PRICE EXT PRICE
24 24.0065
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product