50-9518-11

50-9518-11

Part No50-9518-11
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET 50POS GOLD
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ECAD Module 50-9518-11
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Specification
Series518
PackageBulk
Product StatusActive
TypeDIP, 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid)50 (2 x 25)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature-
In Stock: 18485
available for immediate sale in a store
Pricing
QTY UNIT PRICE EXT PRICE
56 16.5168
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product