MT9HTF12872FY-667G1D6
Part NoMT9HTF12872FY-667G1D6
ManufacturerMicron Technology
DescriptionDRAM Module DDR2 SDRAM 1Gbyte 240FBDIMM Tray
Datasheet
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ECAD Module
Specification
HTS8542.32.00.32
PLLNo
ModuleDRAM Module
PC TypePC2-5300
MountingSocket
ECCN (US)EAR99
PackagingTray
Pin Count240
Lead ShapeNo Lead
CAS Latency5
ECC SupportYes
Module Type240FBDIMM
PCB changed240
Part StatusObsolete
RoHS StatusYes with exemptions
SubcategoryDDR2 SDRAM
Module SidesDouble
Organization128Mx72
Self RefreshNo
Package Width5.1(Max)
Module Density1Gbyte
Package Height30.5(Max)
Package Length133.5(Max)
Refresh Cycles8K
Number of RanksSingle
Supplier PackageFBDIMM
Chip Configuration128Mx8
Chip Density (bit)1G
SPD EEPROM SupportYes
Data Bus Width (bit)72
Number of Chip Banks8
Standard Package NameDIM
Maximum Clock Rate (MHz)667
Number of Chip per Module9
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
In Stock:
4453
available for immediate sale in a store
available for immediate sale in a store
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Associated Product
