115-93-320-41-001000

115-93-320-41-001000

Part No115-93-320-41-001000
DescriptionCONN IC DIP SOCKET 20POS GOLD
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ECAD Module 115-93-320-41-001000
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Specification
Series115
PackageTube
Product StatusActive
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)20 (2 x 10)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBrass Alloy
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature-55°C ~ 125°C
In Stock: 11419
available for immediate sale in a store
Pricing
QTY UNIT PRICE EXT PRICE
1 3.679
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product