117-93-664-41-005000

117-93-664-41-005000

Part No117-93-664-41-005000
DescriptionCONN IC DIP SOCKET 64POS GOLD
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ECAD Module 117-93-664-41-005000
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Specification
Series117
PackageTube
Product StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)64 (2 x 32)
Pitch - Mating0.070" (1.78mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.070" (1.78mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBrass Alloy
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature-55°C ~ 125°C
In Stock: 4338
available for immediate sale in a store
Pricing
QTY UNIT PRICE EXT PRICE
56 15.6722
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product