550-10-068-11-061101

550-10-068-11-061101

Part No550-10-068-11-061101
ManufacturerPreci-Dip
DescriptionPGA SOLDER TAIL
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ECAD Module 550-10-068-11-061101
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Specification
Series550
PackageBulk
Product StatusActive
TypePGA
Number of Positions or Pins (Grid)68 (11 x 11)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostBrass
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature-55°C ~ 125°C
In Stock: 8996
available for immediate sale in a store
Pricing
QTY UNIT PRICE EXT PRICE
504 16.2483
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
Associated Product