32-3552-11
Part No32-3552-11
ManufacturerAries Electronics
DescriptionCONN IC DIP SOCKET ZIF 32POS GLD
Datasheet
Download Now!
ECAD Module
Specification
Series55
PackageBulk
Product StatusActive
TypeDIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)32 (2 x 16)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating-
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post-
Contact Material - PostBeryllium Copper
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Operating Temperature-
In Stock:
14375
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 24 | 34.7692 |
Associated Product
