XR2A-0811-N
Part NoXR2A-0811-N
ManufacturerOmron Electronics Inc-EMC Div
DescriptionCONN IC DIP SOCKET 8POS GOLD
Datasheet
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ECAD Module
Specification
SeriesXR2
PackageBulk
Product StatusActive
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)8 (2 x 4)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostBeryllium Copper
Housing MaterialPolybutylene Terephthalate (PBT), Glass Filled
Operating Temperature-55°C ~ 125°C
In Stock:
4520
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 1 | 1.599 |
Associated Product
