XCVC1702-1MLINSVG1369
RoHS

XCVC1702-1MLINSVG1369

Part NoXCVC1702-1MLINSVG1369
ManufacturerAMD
DescriptionIC VERSAL AI-CORE FPGA 1369BGA
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ECAD Module XCVC1702-1MLINSVG1369
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Specification
PackageTray
SeriesVersal™ AI Core
ProductStatusActive
ArchitectureMPU, FPGA
CoreProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
FlashSize-
RAMSize256KB
PeripheralsDDR, DMA, PCIe
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed600MHz, 1.3GHz
PrimaryAttributesVersal™ AI Core FPGA, 1M Logic Cells
OperatingTemperature-40°C ~ 110°C (TJ)
Package/Case1369-BFBGA, FCBGA
SupplierDevicePackage1369-FCBGA (35x35)
Grade
Qualification
In Stock: 24857
Pricing
QTY UNIT PRICE EXT PRICE
1 23998.1875
10 23518.2238
100 22798.2781
1000 22078.3325
10000 21118.405
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
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