XCVC1702-2HSINSVG1369
RoHS

XCVC1702-2HSINSVG1369

Part NoXCVC1702-2HSINSVG1369
ManufacturerAMD
DescriptionXCVC1702-2HSINSVG1369
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ECAD Module XCVC1702-2HSINSVG1369
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Specification
PackageBulk
SeriesVirtex® UltraScale+™
ProductStatusActive
ArchitectureMPU, FPGA
CoreProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
FlashSize-
RAMSize256KB
PeripheralsDDR, DMA, PCIe
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz, 1.65GHz
PrimaryAttributesVersal™ AI Core FPGA, 1M Logic Cells
OperatingTemperature-40°C ~ 110°C (TJ)
Package/Case1369-BFBGA, FCBGA
SupplierDevicePackage1369-FCBGA (35x35)
Grade
Qualification
In Stock: 7627
Pricing
QTY UNIT PRICE EXT PRICE
1 35996.925
10 35276.9865
100 34197.0788
1000 33117.171
10000 31677.294
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
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