XCVC1702-2MSENSVG1369
RoHS

XCVC1702-2MSENSVG1369

Part NoXCVC1702-2MSENSVG1369
ManufacturerAMD
DescriptionIC VERSAL AI-CORE FPGA 1369BGA
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ECAD Module XCVC1702-2MSENSVG1369
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Specification
PackageTray
SeriesVersal™ AI Core
ProductStatusActive
ArchitectureMPU, FPGA
CoreProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
FlashSize-
RAMSize256KB
PeripheralsDDR, DMA, PCIe
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed600MHz, 1.4GHz
PrimaryAttributesVersal™ AI Core FPGA, 1M Logic Cells
OperatingTemperature0°C ~ 110°C (TJ)
Package/Case1369-BFBGA, FCBGA
SupplierDevicePackage1369-FCBGA (35x35)
Grade
Qualification
In Stock: 12938
Pricing
QTY UNIT PRICE EXT PRICE
1 24840.475
10 24343.6655
100 23598.4512
1000 22853.237
10000 21859.618
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
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