XCVM1302-2HSIVSVD1760
RoHS

XCVM1302-2HSIVSVD1760

Part NoXCVM1302-2HSIVSVD1760
ManufacturerAMD
DescriptionIC VERSALPRIME ACAP FPGA 1760BGA
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ECAD Module XCVM1302-2HSIVSVD1760
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Specification
PackageTray
SeriesVersal™ Prime
ProductStatusActive
ArchitectureMPU, FPGA
CoreProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
FlashSize-
RAMSize-
PeripheralsDDR, DMA, PCIe
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz, 1.65GHz
PrimaryAttributesVersal™ Prime FPGA, 70k Logic Cells
OperatingTemperature-40°C ~ 100°C (TJ)
Package/Case1760-BFBGA, FCBGA
SupplierDevicePackage1760-FCBGA (40x40)
Grade
Qualification
In Stock: 2592
Pricing
QTY UNIT PRICE EXT PRICE
1 6116.525
10 5994.1945
100 5810.6987
1000 5627.203
10000 5382.542
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
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