Specification
MountingSurface Mount
RAM Size128KB
PackagingTray
Pin Count324
Lead ShapeBall
Device Coree200z6
Family NameMPC55xx
PCB changed324
Part StatusObsolete
RoHS StatusRoHS Compliant
Number of I/O220
Package Width23
CECC QualifiedNo
Interface TypeCAN/SCI/SPI
Number of ADCsSingle
Package Height1.95(Max)
Package Length23
ProgrammabilityYes
Special FeatureCAN Controller
Supplier PackageBGA
Core Architecturee200
Program Memory Size3MB
Program Memory TypeFlash
ADC Resolution (bit)12
Data Bus Width (bit)32
Standard Package NameBGA
Maximum Clock Rate (MHz)82
Maximum CPU Frequency (MHz)82
Instruction Set ArchitectureRISC
Maximum Operating Temperature (°C)125
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)5.25|1.65|3.6
Minimum Operating Supply Voltage (V)1.35|1.62|3|4.5
Typical Operating Supply Voltage (V)5|1.8|2.5|3.3
In Stock:
4458
Pricing
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Associated Product
DMN2400UV-13
Diodes Inc.
Small Signal Field-Effect Transistor, 1.33A I(D), 20V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-6
Diodes Inc.
Small Signal Field-Effect Transistor, 1.33A I(D), 20V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-6