AGFB006R24D2E3V
RoHS

AGFB006R24D2E3V

Part NoAGFB006R24D2E3V
ManufacturerIntel
DescriptionIC
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ECAD Module AGFB006R24D2E3V
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Specification
PackageTray
SeriesAgilex F
ProductStatusActive
ArchitectureMPU, FPGA
CoreProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
FlashSize-
RAMSize256KB
PeripheralsDMA, WDT
ConnectivityEBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed1.4GHz
PrimaryAttributesFPGA - 573K Logic Elements
OperatingTemperature0°C ~ 100°C (TJ)
Package/Case2340-BFBGA Exposed Pad
SupplierDevicePackage2340-BGA (45x42)
Grade
Qualification
In Stock: 3173
Pricing
QTY UNIT PRICE EXT PRICE
1 6165.9234
10 6042.6049
100 5857.6272
1000 5672.6495
10000 5426.0126
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
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