K4A8G165WB-BCRC000
Part NoK4A8G165WB-BCRC000
ManufacturerSamsung
Description
Datasheet
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ECAD Module
Specification
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeDDR4 SDRAM
ECCN (US)EAR99
Pin Count96
AutomotiveNo
Lead ShapeBall
PCB changed96
Part StatusActive
Organization512Mx16
Package Width7.5
Interface TypePOD
Package Length13.3
Supplier PackageFBGA
Chip Density (bit)8G
Data Bus Width (bit)16
Standard Package NameBGA
Operating Current (mA)190.4
Address Bus Width (bit)18
Maximum Access Time (ns)0.175
Maximum Clock Rate (MHz)2400
Number of Internal Banks8
Number of Words per Bank64M
Number of Bits/Word (bit)16
Number of I/O Lines (bit)16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.26
Minimum Operating Supply Voltage (V)1.14
Typical Operating Supply Voltage (V)1.2
In Stock:
6617
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Associated Product
