TDA3MVDBABFQ1
RoHS

TDA3MVDBABFQ1

Part NoTDA3MVDBABFQ1
ManufacturerTexas Instruments
DescriptionLOW POWER SOC W/ FULL-FEATURED P
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ECAD Module TDA3MVDBABFQ1
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Specification
PackageTape & Reel (TR)
Series-
ProductStatusActive
ArchitectureDSP, MPU
CoreProcessorARM® Cortex®-M4, C66x
FlashSize-
RAMSize512kB
PeripheralsDMA, PWM, WDT
ConnectivityCANbus, I²C, McASP, MMC/SD/SDIO, SPI, UART, USB
Speed212.8MHz, 500MHz
PrimaryAttributes-
OperatingTemperature-40°C ~ 125°C (TJ)
Package/Case367-BFBGA, FCBGA
SupplierDevicePackage367-FCBGA (15x15)
Grade-
Qualification-
In Stock: 3411
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Shipping Information
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