TDA3MVSB1FABFQ1
Part NoTDA3MVSB1FABFQ1
ManufacturerTexas Instruments
DescriptionPROTOTYPE
Datasheet
Download Now!
Specification
PackageBulk
Series-
ProductStatusActive
ArchitectureDSP, MPU
CoreProcessorARM® Cortex®-M4, C66x
FlashSize-
RAMSize512kB
PeripheralsDMA, PWM, WDT
ConnectivityCANbus, I²C, McASP, MMC/SD/SDIO, SPI, UART, USB
Speed212.8MHz, 1GHz
PrimaryAttributes-
OperatingTemperature-40°C ~ 125°C (TJ)
Package/Case367-BFBGA, FCBGA
SupplierDevicePackage367-FCBGA (15x15)
Grade-
Qualification-
In Stock:
4247
Pricing
QTY | UNIT PRICE | EXT PRICE |
---|---|---|
1 | Get latest price! | - |
10 | Get latest price! | - |
100 | Get latest price! | - |
1000 | Get latest price! | - |
10000 | Get latest price! | - |