XC17S50APDG8C
Part NoXC17S50APDG8C
ManufacturerXilinx
DescriptionIC PROM SER 50K C-TEMP 8-DIP
Datasheet
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ECAD Module
Specification
Width7.62mm
Length9.3599mm
Density1 Mb
I/O TypeCOMMON
ECCN CodeEAR99
PackagingTube
Pin Count8
Published1999
TechnologyCMOS
Memory Size500kb
Part StatusObsolete
Pbfree Codeyes
RoHS StatusRoHS Compliant
Memory Width1
Organization559200X1
JESD-609 Codee3
Mounting TypeThrough Hole
Surface MountNO
Memory IC TypeCONFIGURATION MEMORY
Number of Pins8
Package / Case8-DIP (0.300, 7.62mm)
Supply Voltage3.3V
Terminal Pitch2.54mm
Parallel/SerialSERIAL
Terminal FinishMatte Tin (Sn)
Base Part NumberXC17S50A
Voltage - Supply3V~3.6V
Programmable TypeOTP
Terminal PositionDUAL
Supply Current-Max0.015mA
Height Seated (Max)4.5974mm
Number of Functions1
Radiation HardeningNo
Standby Current-Max0.001A
Operating Temperature0°C~70°C
Number of Terminations8
Output Characteristics3-STATE
Operating Supply Voltage3.3V
Supply Voltage-Max (Vsup)3.6V
Supply Voltage-Min (Vsup)3V
Peak Reflow Temperature (Cel)250
Moisture Sensitivity Level (MSL)1 (Unlimited)
Time@Peak Reflow Temperature-Max (s)30
In Stock:
18180
available for immediate sale in a store
available for immediate sale in a store
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Associated Product
