XC7Z045-3FFG900E
Part NoXC7Z045-3FFG900E
ManufacturerXilinx
DescriptionIC SOC CORTEX-A9 KINTEX7 900FBGA
Datasheet
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ECAD Module
Specification
Length31mm
SeriesZynq®-7000
HTS Code8542.39.00.01
RAM Size256KB
ECCN Code3A991.D
Frequency1GHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
PackagingTray
Published2009
TechnologyCMOS
Memory TypeROMless
Part StatusActive
PeripheralsDMA
RAM (words)256000
RoHS StatusROHS3 Compliant
Speed Grade-3
ArchitectureMCU, FPGA
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
JESD-30 CodeS-PBGA-B900
Boundary ScanYES
JESD-609 Codee1
Number of I/O130
Surface MountYES
Terminal FormBALL
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Data Bus Width32b
Package / Case900-BBGA, FCBGA
Supply Voltage1V
Terminal Pitch1mm
Contact PlatingCopper, Silver, Tin
Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Base Part NumberXC7Z045
Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
Core ArchitectureARM
Factory Lead Time10 Weeks
Terminal PositionBOTTOM
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Height Seated (Max)3.35mm
Radiation HardeningNo
Operating Temperature0°C~100°C TJ
Number of Terminations900
Operating Supply Voltage1V
Supply Voltage-Max (Vsup)1.05V
Peak Reflow Temperature (Cel)245
Moisture Sensitivity Level (MSL)4 (72 Hours)
Time@Peak Reflow Temperature-Max (s)30
In Stock:
224
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 1 | 2167.9 | |
| 10 | 2124.542 | |
| 100 | 2059.505 | |
| 1000 | 1994.468 | |
| 10000 | 1907.752 |
Associated Product
