XC7Z100-1FFG900I
Part NoXC7Z100-1FFG900I
ManufacturerXilinx
DescriptionIC SOC CORTEX-A9 667MHZ 900FCBGA
Datasheet
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ECAD Module
Specification
Width31mm
Length31mm
SeriesZynq®-7000
HTS Code8542.39.00.01
RAM Size256KB
ECCN Code3A991.D
Frequency667MHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
PackagingTube
Published2010
TechnologyCMOS
Part StatusActive
PeripheralsDMA
RAM (words)256000
RoHS StatusROHS3 Compliant
ArchitectureMCU, FPGA
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
JESD-30 CodeS-PBGA-B900
Boundary ScanYES
JESD-609 Codee1
Number of I/O212
Surface MountYES
Terminal FormBALL
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Package / Case900-BBGA, FCBGA
Supply Voltage1V
Terminal Pitch1mm
Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Base Part NumberXC7Z100
Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
Core ArchitectureARM
Factory Lead Time10 Weeks
Terminal PositionBOTTOM
Primary AttributesKintex™-7 FPGA, 444K Logic Cells
Height Seated (Max)3.35mm
Radiation HardeningNo
Operating Temperature-40°C~100°C TJ
Number of Terminations900
Supply Voltage-Max (Vsup)1.05V
Supply Voltage-Min (Vsup)0.95V
Peak Reflow Temperature (Cel)245
Moisture Sensitivity Level (MSL)4 (72 Hours)
Time@Peak Reflow Temperature-Max (s)30
In Stock:
269
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 1 | 1809.5 | |
| 10 | 1773.31 | |
| 100 | 1719.025 | |
| 1000 | 1664.74 | |
| 10000 | 1592.36 |
Associated Product
