FDC602P
Part NoFDC602P
ManufacturerON Semiconductor
DescriptionMOSFET P-CH 20V 5.5A SSOT-6
Datasheet
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ECAD Module
Specification
Vgs(th) (Max) @ Id1.5V @ 250µA
Vgs (Max)±12V
TechnologyMOSFET (Metal Oxide)
Supplier Device PackageSuperSOT™-6
SeriesPowerTrench®
Rds On (Max) @ Id, Vgs35 mOhm @ 5.5A, 4.5V
Power Dissipation (Max)1.6W (Ta)
PackagingCut Tape (CT)
Package / CaseSOT-23-6 Thin, TSOT-23-6
Other NamesFDC602PCT
Operating Temperature-55°C ~ 150°C (TJ)
Mounting TypeSurface Mount
Moisture Sensitivity Level (MSL)1 (Unlimited)
Manufacturer Standard Lead Time42 Weeks
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Input Capacitance (Ciss) (Max) @ Vds1456pF @ 10V
Gate Charge (Qg) (Max) @ Vgs20nC @ 4.5V
FET TypeP-Channel
FET Feature-
Drive Voltage (Max Rds On, Min Rds On)2.5V, 4.5V
Drain to Source Voltage (Vdss)20V
Detailed DescriptionP-Channel 20V 5.5A (Ta) 1.6W (Ta) Surface Mount SuperSOT™-6
Current - Continuous Drain (Id) @ 25°C5.5A (Ta)
In Stock:
46256
available for immediate sale in a store
available for immediate sale in a store
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 1 | 0.6527 | |
| 10 | 0.6396 | |
| 100 | 0.6201 | |
| 1000 | 0.6005 | |
| 10000 | 0.5744 |
Associated Product
PC28F256M29EWLA
Micron
NOR Flash Parallel 3V/3.3V 256Mbit 32M/16M x 8bit/16bit 100ns 64-Pin Fortified BGA Tray
Micron
NOR Flash Parallel 3V/3.3V 256Mbit 32M/16M x 8bit/16bit 100ns 64-Pin Fortified BGA Tray
